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10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound

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10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound
10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound
10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound
10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound
10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound
10:1 Conductive Adhesive Thermal Conductive Potting Compound Adhesive Silicone AB Glue Electronic Sealing Potting Compound

Key attributes

Industry-specific attributes

CAS No.
29894-35-7
Purity
90

Other attributes

Place of Origin
Shandong, China
Type
Adsorbent
Usage
Coating Auxiliary Agents
Classification
Chemical Auxiliary Agent
Other Names
heat stabilizer
MF
C18H36O2
EINECS No.
200-313-4
Brand Name
bmt

Lead time

Product descriptions from the supplier

>= 10 tons
£711.93

Quantity

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£0.00
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£0.00

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