Lead-Free Assembly BGA (Ball Grid Array) X-ray Inspection 2024 best PCB SMT Soldering Reflow Oven Wave Soldering Process

Name: Lead-Free Assembly BGA (Ball Grid Array) X-ray Inspection 2024 best PCB SMT Soldering Reflow Oven Wave Soldering Process
Brand: INTELLISENSE TECHNOLOGY
SKU: 10000020917818
Price: 1,599 USD
Availability: InStock

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INTELLISENSE TECHNOLOGY17 yrs

Lead-Free Assembly BGA (Ball Grid Array) X-ray Inspection 2024 best PCB SMT Soldering Reflow Oven Wave Soldering Process

Key attributes

Other attributes

Model Number

Type

smart electronics pcba

Place of Origin

Punjab, India

Brand Name

Intellisense

Copper Thickness

custom

Supplier Type

Custom

Functional Application

Custom

Product name

PCBA Board Assembly

Application

Electronics Device

Surface Finishing

OSP

Material

FR-4

Service

One-stop Turnkey

Certificate

ISO9001

Keywords

PCBA OEM PCB Assembly

Solder mask color

Blue.green.red.black.white.etc

Base Material

FR4/ROGERS/Aluminum/High TG

PCBA service

SMD SMT DIP Component Assembly

Lead time

Product descriptions from the supplier

10 - 10 units

£1,594.79

11 - 11 units

£1,594.00

12 - 12 units

£1,328.47

>= 13 units

£1,275.04

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable

Item subtotal (0 variations 0 items)

£0.00

Shipping total

£0.00

Subtotal

£0.00

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Quantity (units)	1 - 20	21 - 30	31 - 40	> 40
Lead time (days)	7	7	7	To be negotiated