Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

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SEMSHINE TECH PTE.LTD1 yr

SG

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Multilayer Fr4 PCB Printed Circuit Board Assembly HDI PCB Design for Electronics Motherboard Assembly with PCBA

Key attributes

Industry-specific attributes

Base Material

FR4

Board Thickness

1.6MM

Other attributes

Model Number

semshine-240019

Type

hdi pcb

Place of Origin

Guangdong, China

Brand Name

SEMSHINE

Copper Thickness

1OZ/2OZ/3OZ

Min. Hole Size

0.1MM

Min. Line Width

0.08MM

Min. Line Spacing

0.1MM

Surface Finishing

LF-HASL

Board Size

100*100MM

Lead time

Product descriptions from the supplier

1 - 999 pieces

£1.34

1000 - 9999 pieces

£1.02

10000 - 99999 pieces

£0.78

>= 100000 pieces

£0.7004

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable

Item subtotal (0 variations 0 items)

£0.00 - £0.00

Shipping total

£0.00

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