PCB waterproof protection low pressure molding bostik PA hot melt adhesive

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LA MIEUX PRODUCTS, LTD.5 yrs

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

PCB waterproof protection low pressure molding bostik PA hot melt adhesive

Key attributes

Industry-specific attributes

CAS No.

63428-84-2

Other attributes

Place of Origin

France

Main Raw Material

Polyamide

Usage

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil

Classification

Hot Melt Adhesives

Brand Name

BOSTIK

Model Number

THERMELT 195 Black

Type

Hot Melt Adhesives

Application

Low pressure molding

Raw Material

PA (Polyamide)

Features

Water Resistance

Color

Black

Certificate

ROHS, REACH, ISO9001

Shape

Granule and stick

Package

Woven bag with polyethylene bag

Waterproof Standard

IP65, IP67

Flame Resistance

V0, V2

Grade

Injection Molding Grade

Packaging and delivery

Packaging Details

Plastic bag inside, carton for outside packing

Selling Units:

Single item

Single package size:

28X18X3 cm

Single gross weight:

20.000 kg

Supply Ability

Supply Ability

100000 Kilogram/Kilograms per Year

Lead time

Product descriptions from the supplier

Minimum order quantity: 20 kilograms

£9.57-15.16

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable

Item subtotal (0 variations 0 items)

£0.00 - £0.00

Shipping total

£0.00

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