Place of Origin
South Korea
Main Raw Material
THDM-S: Silicone Adhesive, THDM-E: Epoxy Adhesive
Classification
Other Adhesives
Model Number
THDM-S, THDM-E
Type
THDM-S: Silicone Adhesive, THDM-E: Epoxy Adhesive
Thermal Conductivity
2 W/mK, 3 W/mK, 4 W/mK available for both products
Adhesive Strength
Approximately 105 N/cm²
Tensile Shear Adhesive Strength
Approximately 60 N/cm²
Curing Method
Room temperature curing
Unit of Sale
20L barrel or drum bulk